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Branch:
Electrical and Electronics Engineering
Placement Session:
2023-24
Offer obtained:
6M Internship + FTE
Description of role:
Level 3 software engineer
Job location:
Hyderabad
Eligible Branches:
CSE,ECE,EEE
Eligibility Criteria:
7+ CGPA
Selection Procedure:
Round 1 - OT
Round 2 - Technical
Round 3 - System Design
Round 4 - HR
Description of Online test:
OT questions were medium to hard, questions were based on graphs and DP.
I was able to solve only two questions out of three
Description of Technical Interview:
Round 1
Question - https://leetcode.com/problems/design-a-text-editor/description/
It was an implementation question, I had to design and implement a text editor with the given functionality.
I was able to cover the functionality and edge cases well, and the interviewer was satisfied.
There was another DSA question which I don't remember
Round 2
This was a system design round, the interviewer asked me to give a high level design for URL shortening web application including all the functionality and server side design as well.
Description of HR Round:
HR round was the elimination round, only four out of twelve cleared the HR.
Questions were pretty routine behavioural and culture fit related
Preparation Strategy:
Focus on DSA and start preparing as soon as you can, the more time you spend, the more new things you can learn.
Work on some full stack development projects
Resources:
GFG, Stiver’s SDE Sheet, Leetcode, YT
Additional info for our viewers:
NA