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Branch:
Electrical and Electronics Engineering
Session:
2022-2023
Offer obtained:
Internship
Description of role:
NA
Job/Intern location:
Bangalore/Hyderabad
Eligible Branches:
NA
Eligibility Criteria:
CGPA - 7.5
Selection Procedure:
Internship through Microsoft Engage programme.
OT-1: DSA-based simple MCQ
OT-2: a basic descriptive question
Project round
Interview round 1
Interview round 2
Description of Online test:
DSA only
Description of Technical Interview:
Implementation based questions. I had to code on codility.
Link of question : https://leetcode.com/problems/multiply-strings/
Link of list of questions asked in Microsoft Engage programme in interview rounds: https://docs.google.com/spreadsheets/d/1CiQtfe1d6kgGl220yjRGigrjFv3I4d6xtNH6wSmTJ6E/edit?usp=sharing
Description of HR Round:
Actually for me it was an AA round. The AA round is basically a technical plus an HR round. A question was given and then general HR questions were asked.
Preparation Strategy:
DSA is must. After that, learn DBMS and OOPs, and do one project and practice on platforms like leetcode, codeforces. In the last month, follow leetcode more.
Resources:
GFG, leetcode, aditya verma(for dp), striver(for graphs)
Additional info for our viewers:
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